SIPLUS ET 200SP CM 4 x IO-Link ST -40 ... +60 °C Startup -25 °C with conformal coating

SIPLUS ET 200SP CM 4xIO-LINK based on 6ES7137-6BD00-0BA0 with conformal coating, -40…+60 °C, communication module IO-Link master V1.1 SIMATIC ET 200SP is a modular, scalable, and highly flexible distributed I/O system. With its small footprint, it is particularly well-suited for installation in small control boxes near the machine. The modules can either be plugged directly into an ET 200SP CPU or connected to a central controller via PROFINET or PROFIBUS. SIMATIC ET 200SP can be expanded with up to 64 I/O modules, which can be inserted in any combination. The system provides a very comprehensive range of modules. Many modules are also available with a wide variety of characteristics, which considerably improve the scalability in regard to functionality and price. Thus, in addition to modules with standard functions (ST), modules with an extended range of functions and diagnostics (HF High Feature / HS High Speed) are also available. For price-sensitive applications, there are modules with basic functions (BA). The advantage of the ET 200SP system is in its ease of application, such as through the free selection of the PROFINET connection technology via the BusAdapter, the tool-free wiring by means of push-in technology, improved accessibility of the wiring due to a new arrangement of the spring releases, in addition to the associated conductor aperture and the channel-precise diagnostic functions. The availability and productivity of the machine are ensured by the capability of swapping modules and terminal boxes during operation, the so-called "hot swapping". SIPLUS extreme communication modules are specially designed for harsh ambient conditions. To ensure that biologically, chemically and physically active substances do not negatively impact your automation system.